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CERAMIC CAPACITOR ARRAY
FEATURES
* * *
Four individual capacitors inside one 1206 monolithic structure Saves board and inventory space One placement instead of four - less costly
* * *
Easier to handle and solder than 4 smaller chips Tape and reel per EIA 481-1 RoHS Compliant
CAPACITOR OUTLINE DRAWING
T L CL BW W P/2 Ref P
BW1
TABLE 1 EIA DIMENSIONS - MILLIMETERS (INCHES)
Size Code 1632 Length L 3.2 (0.126) 0.2 (0.008) Width W 1.6 (.063) 0.2 (.008) Thickness T (max.) 0.7 - 1.35 (0.027 - 0.053) Bandwidth BW Bandwidth BW1 Pitch P
0.40 (0.016) 0.1 - 0.5 0.8 (0.031) 0.2 (0.008) (0.004 - 0.020) 0.1 (0.004)
CERAMIC ARRAY ORDERING INFORMATION
C 1632 C 103 K 5 R A C END METALLIZATION C-Standard (Tin-plated nickel barrier) FAILURE RATE LEVEL A- Not Applicable TEMPERATURE CHARACTERISTIC Designated by Capacitance Change Over T emperature Range G - C0G (NP0) (30 PPM/C) R - X7R (15%) VOLTAGE 5 = 50v; 3 = 25v; 4 = 16v; 8=10v CERAMIC EIA SIZE CODE Ceramic chip array SPECIFICATION C - Standard CAPACITANCE CODE Expressed in Picofarads (pF) First two digits represent significant figures. Third digit specifies number of zeros. (Use 9 for 1.0 thru 9.9pF (Example: 2.2pF = 229 . CAPACITANCE TOLERANCE K - 10%: M - 20% Standard Tolerances Contact factory for any special requirements.
(c)KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
85
Ceramic Surface Mount
Notes: 1. Metric is controlling - English for reference only. 2. Pitch (P) tolerances are non-cumulative along the package. 3. Thickness (T) depends on capacitance.
CERAMIC CHIP ARRAY
TABLE 2A C0G DIELECTRIC - CAPACITANCE RANGE
Capacitance Values (pF) KEMET Part Number Capacitance Tolerance
1632 CERAMIC ARRAY LAND PATTERN LAYOUT
100V 200V
10V 16V
25V
50V
6 Places
P
X
8 Places
10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470
C1632C100(1)(2)GAC C1632C120(1)(2)GAC C1632C150(1)(2)GAC C1632C180(1)(2)GAC C1632C220(1)(2)GAC C1632C270(1)(2)GAC C1632C330(1)(2)GAC C1632C390(1)(2)GAC C1632C470(1)(2)GAC C1632C560(1)(2)GAC C1632C680(1)(2)GAC C1632C820(1)(2)GAC C1632C101(1)(2)GAC C1632C121(1)(2)GAC C1632C151(1)(2)GAC C1632C181(1)(2)GAC C1632C221(1)(2)GAC C1632C271(1)(2)GAC C1632C331(1)(2)GAC C1632C391(1)(2)GAC C1632C471(1)(2)GAC
K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M
100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471
100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471
100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471
100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181
100 120 150 180 220 270 330 390 470 560 680 820
G
Z
C
Y
Additional pad dimension information is available in KEMET Technical Bulletin F-2100.
(1) To complete the KEMET part number, insert the alpha code for the tolerance desired. K = 10% and M = 20% - standard tolerance. Contact factory for any special requirements. (2) To complete the KEMET part number, insert appropriate number for voltage desired: "5" = 50 volts, "3" = 25 volts, "4" = 16 volts, and "8" = 10 volts.
LAND PATTERN DIMENSIONS - CERAMIC CHIP CAPACITOR ARRAYS - MM
Reflow Solder Dimension Z 3216 2.80
100V 200V
Calculation Formula Z = Lmin + 2Jt + Tt G = Smax - 2Jh -Th X = Wmin + 2Js + Ts Tt, Th, Ts = Combined tolerances
TABLE 2B X7R DIELECTRIC - CAPACITANCE RANGE
Capacitance Values (pF) KEMET Part Number Capacitance Tolerance
G 0.40
X Y(ref) C(ref) P(ref) 0.80 0.52 1.20 1.60
10V 16V
25V
50V
330 390 470 560 680 820 1000 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 10,000 12,000 15,000 18,000 22,000 27,000 33,000 39,000 47,000 56,000 68,000 82,000 100,000
C1632C331(1)(2)RAC C1632C391(1)(2)RAC C1632C471(1)(2)RAC C1632C561(1)(2)RAC C1632C681(1)(2)RAC C1632C821(1)(2)RAC C1632C102(1)(2)RAC C1632C122(1)(2)RAC C1632C152(1)(2)RAC C1632C182(1)(2)RAC C1632C222(1)(2)RAC C1632C272(1)(2)RAC C1632C332(1)(2)RAC C1632C392(1)(2)RAC C1632C472(1)(2)RAC C1632C562(1)(2)RAC C1632C682(1)(2)RAC C1632C822(1)(2)RAC C1632C103(1)(2)RAC C1632C123(1)(2)RAC C1632C153(1)(2)RAC C1632C183(1)(2)RAC C1632C223(1)(2)RAC C1632C273(1)(2)RAC C1632C333(1)(2)RAC C1632C393(1)(2)RAC C1632C473(1)(2)RAC C1632C563(1)(2)RAC C1632C683(1)(2)RAC C1632C823(1)(2)RAC C1632C104(1)(2)RAC
K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M
331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104
331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223
331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223
331 391 471 561 681 821 102 122 152 182 222 272 332 392 472
331 391 471 561
(1) To complete the KEMET part number, insert the alpha code for the tolerance desired: K = 10% and M = 20% - standard tolerances. Contact factory for any special requirements. (2) To complete the KEMET part number, insert appropriate number for voltage desired: "5" = 50 volts, "3" = 25 volts, "4" = 16 volts, and "8" = 10 volts.
86
(c)KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP CAPACITORS
Packaging Information
Tape & Reel Packaging
KEMET offers Multilayer Ceramic Chip Capacitors packaged in 8mm and 12mm plastic tape on 7" and 13" reels in accordance with EIA standard 481-1: Taping of surface mount components for automatic handling. This packaging system is compatible with all tape fed automatic pick and place systems. See page 78 for details on reeling quantities for commercial chips and page 87 for MIL-PRF-55681 chips. g handling. This packaging system is compatible with all tape fed automatic pick and place systems. See page 81 for details on reeling quantities for commercial chips and page 90 for MIL-PRF-55681 chips.
Anti-Static Reel Embossed Carrier* 0402 and 0603 case sizes available on punched paper only. Chip Orientation in Pocket (except 1825 Commercial, and 1825 & 2225 Military)
(R)
KE
ME
T
Embossment 8mm .30 (.315 .012") or 12mm .30 (.472 .012")
178mm (7.00") or 330mm (13.00")
Anti-Static Cover Tape (.10mm (.004") Max Thickness)
* Punched paper carrier used for 0402 and 0603 case size.
SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
Grid Grid placement courtyard Placement
Reflow Solder Dimension 0402 0603 0805 1206 1210 1812 1825 2220 2225 Z 2.14 2.78 3.30 4.50 4.50 5.90 5.90 7.00 7.00 G 0.28 0.68 0.70 1.50 1.50 2.30 2.30 3.30 3.30 X Y(ref) C(ref) 0.74 0.93 1.21 1.08 1.05 1.73 1.60 1.30 2.00 2.00 1.50 3.00 2.90 1.50 3.00 3.70 1.80 4.10 6.90 1.80 4.10 5.50 1.85 5.15 6.80 1.85 5.15 Z 3.18 3.70 4.90 4.90 G
Wave Solder X 0.80 1.10 1.40 2.00 Y(ref) Smin 1.25 1.50 1.70 1.70 1.93 2.20 3.20 3.20
Not Recommended
Courtyard C
C
0.68 0.70 1.50 1.50
X
X
Not Recommended
GG Y Z
Z
Y
Calculation Formula Z = Lmin + 2Jt + Tt G = Smax - 2Jh -Th X = Wmin + 2Js + Ts Tt, Th, Ts = Combined tolerances
(c)KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
93
Packaging
TANTALUM, CERAMIC AND ALUMINUM CHIP CAPACITORS
Packaging Information
Performance Notes
1. Cover Tape Break Force: 1.0 Kg Minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 Newton to 1.0 Newton (10g to 100g) 12 mm 0.1 Newton to 1.3 Newton (10g to 130g) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 10 mm/minute. 3. Reel Sizes: Molded tantalum capacitors are available on either 180 mm (7") reels (standard) or 330 mm (13") reels (with C-7280). Note that 13" reels are preferred. 4. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA-556.
Embossed Carrier Tape Configuration: Figure 1
Table 1 -- EMBOSSED TAPE DIMENSIONS (Metric will govern) Constant Dimensions -- Millimeters (Inches)
Tape Size 8 mm and 12 mm D0 E P0 4.0 0.10 (0.157 0.004) P2 2.0 0.05 (0.079 0.002) T Max 0.600 (0.024) T1 Max 0.100 (0.004) 1.5 1.75 0.10 +0.10 -0.0 (0.059 (0.069 0.004) +0.004, -0.0) Pitch Single (4 mm) B1 Max. Note 1 4.4 (0.173) 12 mm Double (8 mm) 8.2 (0.323) D1 Min. Note 2 1.0
Variable Dimensions -- Millimeters (Inches)
Tape Size 8 mm F 3.5 0.05 P1 4.0 0.10 R Min. Note 3 25.0 T2 Max 2.5 (0.098) W 8.0 0.30 (.315 0.012) A0B0K0 Note 4
(0.039) (0.138 0.002) 1.5 5.5 0.05 (0.059) (0.217 0.002)
(0.157 0.004) (0.984) 8.0 0.10 30.0 (0.315 0.004) (1.181)
4.6 12.0 0.30 (0.181) (0.472 0.012)
NOTES
1. B1 dimension is a reference dimension for tape feeder clearance only. 2. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 3. Tape with components shall pass around radius "R" without damage (see sketch A). The minimum trailer length (Fig. 2) may require additional length to provide R min. for 12 mm embossed tape for reels with hub diameters approaching N min. (Table 2) 4. The cavity defined by A0, B0, and K0 shall be configured to surround the part with sufficient clearance such that the chip does not protrude beyond the sealing plane of the cover tape, the chip can be removed from the cavity in a vertical direction without mechanical restriction, rotation of the chip is limited to 20 degrees maximum in all 3 planes, and lateral movement of the chip is restricted to 0.5 mm maximum in the pocket (not applicable to vertical clearance.)
94
(c)KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
TANTALUM, CERAMIC AND ALUMINUM CHIP CAPACITORS
Packaging Information Embossed Carrier Tape Configuration (cont.)
20
Sketch D: Tape Camber (Top View)
1mm (0.039) Max.
250mm (9.843) Allowable camber to be 1 mm/250 mm.
1mm (0.039) Max.
400mm (15.75) Min.
Figure 2: Tape Leader & Trailer Dimensions (Metric Dimensions Will Govern)
Figure 3: Reel Dimensions (Metric Dimensions will govern)
Table 2 - REEL DIMENSIONS (Metric will govern)
Tape Size 8 mm A Max 330.0 (12.992) B* Min 1.5 (0.059) C 13.0 0.20 (0.512 0.008) D* Min 20.2 (0.795) N Min 50.0 (1.969) See Note 3 Table 1 W1 8.4 +1.5, -0.0 (0.331 +0.059, -0.0) 12.4 +2.0, -0.0 (0.488 +0.078, -0.0) W2 Max 14.4 (0.567) W3 7.9 Min (0.311) 10.9 Max (0.429) 11.9 Min (0.469) 15.4 Max (0.606)
12 mm
330.0 (12.992)
1.5 (0.059)
13.0 0.20 (0.512 0.008)
20.2 (0.795)
18.4 (0.724)
(c)KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
95
Packaging
CERAMIC CHIP CAPACITORS
Packaging Information Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only):
T P0 D0
Top Tape Cover
P2
10 pitches cumulative tolerance on tape 0.2 (0.008) E
Bottom Tape Cover
A0 B0 G2
Max. Cavity Size See Note 1 Table 1
F
W
T1
User Direction of Feed
P1
Center lines of cavity
Table 1: 8 & 12mm Punched Tape (Metric Dimensions Will Govern)
Constant Dimensions - Millimeters (Inches)
Tape Size D0 E P0 P2 T1 G1 G2 R Min.
8mm 1.5 1.75 0.10 4.0 0.10 2.0 0.05 0.10 0.75 0.75 25 (.984) and +0.10, -0.0 (.004) (.030) (.030) See Note 2 12mm (.059 (.069 0.004) (.157 0.004) (.079 0.002) Max. Min. Min. Table 1 +0.004, -0.0)
Table 1: 8 & 12mm Punched Tape (Metric Dimensions Will Govern)
Variable Dimensions - Millimeters (Inches)
Tape Size P1 F
W
A0B0
T
8mm 1/2 Pitch 8mm 12mm
2.0 0.10 (.079 .004) 3.5 0.05 See Requirements Section 3.3 (d) (.138 .002) 4.0 0.10 (0.157 .004) 4.0 0.10 (0.157 .004) 5.5 0.05
8.0 0.3 (.315 0.012)
See Note 1 Table 1
12.0 0.3 (.472 .012)
1.1mm (.043) Max. for Paper Base Tape and 1.6mm (.063) Max. for NonPaper Base Compositions. See Note 3.
12mm 8.0 0.10 (.217 .002) Double (0.315 .004) Pitch
Note: 1. A0, B0 and T determined by the maximum dimensions to the ends of the terminals extending from the body and/or the body dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A0, B0 and T) must be within 0.05mm (.002) minimum and 0.50mm (.020) maximum. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches A and B). 2. Tape with components shall pass around radius "R" without damage. 3. KEMET nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum.
Sketch B: Max. Component Rotation - Front Cross Sectional View
20
Sketch C: Component Rotation - Top View
Maximum 20 component rotation.
Sketch A: Bending Radius See Note 2 Table 1
R (Min.)
Typical component center line
96
(c)KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP CAPACITORS
Packaging Information
Bulk Cassette Packaging (Ceramic Chips only)
(Meets Dimensional Requirements IEC-286-6 and EIAJ 7201)
6.8 0.1 8.8 0.1 12.0 0.1
Table 2 - Capacitance Values Available In Bulk Cassette Packaging
Min. Max. Case Cap Cap Size Dielectric Voltage Value Value 0402 0603 0805 All All C0G All All 200 100 50 200 100 50 25 16 25 16 All All 109 109 109 221 221 221 221 221 104 104 All All 181 331 102 392 103 273 104 104 224 224
53.3*
Unit: mm * Reference
10*
1.5 2.0 3.0
0.1 0 0 0.1 0.2 0
X7R
31.5 0.2 0 36 0 0.2 19.0*
110 0.7
5.0*
Y5V
Table 1 - Capacitor Dimensions for Bulk Cassette Packaging - Millimeters
Metric Size Code 1005 1608 2012 EIA Size Code 0402 0603 0805 Length L Width W Thickness Bandwidth T B 0.5 .05 0.8 .07 0.6 .10 0.2 to 0.4 0.2 to 0.5 0.5 to 0.75 Minimum Separation S 0.3 0.7 0.75 Number of Pcs/Cassette 50,000 15,000 10,000
1.0 0.05 0.5 0.05 1.6 0.07 0.8 0.07 2.0 0.10 1.25 0.10
Terminations: KEMET nickel barrier layer with a tin overplate.
CAPACITOR MARKING TABLE (Marking Optional - Not Available for 0402 Size or Y5V Dielectric)
Numeral Alpha Character
Capacitance (pF) For Various Numeral Identifiers 9 0 1 2 3 4 5 6 7
A B C D E F G H J K L M N P Q R S T U V W X Y Z a b d e f m n t y
0.10 0.11 0.12 0.13 0.15 0.16 0.18 0.20 0.22 0.24 0.27 0.30 0.33 0.36 0.39 0.43 0.47 0.51 0.56 0.62 0.68 0.75 0.82 0.91 0.25 0.35 0.40 0.45 0.50 0.60 0.70 0.80 0.90
1.0 1.1 1.2 1.3 1.5 1.6 1.8 2.0 2.2 2.4 2.7 3.0 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 2.5 3.5 4.0 4.5 5.0 6.0 7.0 8.0 9.0
10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 25 35 40 45 50 60 70 80 90
100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 250 350 400 450 500 600 700 800 900
1000 1100 1200 1300 1500 1600 1800 2000 2200 2400 2700 3000 3300 3600 3900 4300 4700 5100 5600 6200 6800 7500 8200 9100 2500 3500 4000 4500 5000 6000 7000 8000 9000
10,000 11,000 12,000 13,000 15,000 16,000 18,000 20,000 22,000 24,000 27,000 30,000 33,000 36,000 39,000 43,000 47,000 51,000 56,000 62,000 68,000 75,000 82,000 91,000 25,000 35,000 40,000 45,000 50,000 60,000 70,000 80,000 90,000
100,000 110,000 120,000 130,000 150,000 160,000 180,000 200,000 220,000 240,000 270,000 300,000 330,000 360,000 390,000 430,000 470,000 510,000 560,000 620,000 680,000 750,000 820,000 910,000 250,000 350,000 400,000 450,000 500,000 600,000 700,000 800,000 900,000
1,000,000 1,100,000 1,200,000 1,300,000 1,500,000 1,600,000 1,800,000 2,000,000 2,200,000 2,400,000 2,700,000 3,000,000 3,300,000 3,600,000 3,900,000 4,300,000 4,700,000 5,100,000 5,600,000 6,200,000 6,800,000 7,500,000 8,200,000 9,100,000 2,500,000 3,500,000 4,000,000 4,500,000 5,000,000 6,000,000 7,000,000 8,000,000 9,000,000
10,000,000 11,000,000 12,000,000 13,000,000 15,000,000 16,000,000 18,000,000 20,000,000 22,000,000 24,000,000 27,000,000 30,000,000 33,000,000 36,000,000 39,000,000 43,000,000 47,000,000 51,000,000 56,000,000 62,000,000 68,000,000 75,000,000 82,000,000 91,000,000 25,000,000 35,000,000 40,000,000 45,000,000 50,000,000 60,000,000 70,000,000 80,000,000 90,000,000
Laser marking is available as an extra-cost option for most KEMET ceramic chips. Such marking is two sided, and includes a K to identify KEMET, followed by two characters (per EIA-198 - see table below) to identify the capacitance value. Note that marking is not available for size 0402 nor for any Y5V chip. In addition, the 0603 marking option is limited to the K only.
KA3
Example shown is 1,000 pF capacitor.
(c)KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
97
Packaging

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